44 x 44 x 5 mm of Copper Plate
Contrary to heat sinks which use a copper core (copper poured inside aluminium), we use more material over the DIE where high energy flows (copper plate) and in the external areas where low energy flows, less material (only 5mm aluminium plate). Thus we achieve a better efficiency, hence better cooling performance without increasing the weight.

Tin Connection between Copper and Aluminium
The heat transfer of conventional copper cores onto aluminium is ensured by thermal compound, which transfers the warmth extremely poorly compared to metals. In contrast to this we use a super-thin tin film. This has the advantage of approx. 25-times higher heat conductivity of tin compared with the thermal compound. Disadvantages are higher manufacturing costs and appearance.

Extra Large Heatsink
The wider and longer heat sink offers despite smaller overall height (33 mm of incl. copper plate) compared to silent better results. The width of 76 mm is in range as AMD intended conform, except in the area directly beside the socket by AMD defined as "height restriction Area". This has the consequence that the heatsink will not fit on approx. 10% of all current .......

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