RADEONX2900 Chipset Features and Specifications
Ring Bus Memory Controller
Fully distributed design with 1024-bit internal ring bus for memory reads and writes
- Optimized for high performance HDR (High Dynamic Range) rendering at high display resolutions
Unified Superscalar Shader Architecture
320 stream processing units
Dynamic load balancing and resource allocation for vertex, geometry, and pixel shaders
128-bit floating point precision for all operations
Command processor for reduced CPU overhead
Shader instruction and constant caches
Up to 80 texture fetches per clock cycle
Up to 128 textures per pixel
Fully associative multi-level texture cache design
DXTC and 3Dc+ texture compression
High resolution texture support (up to 8192 x 8192)
Fully associative texture Z/stencil cache designs
Double-sided hierarchical Z/stencil buffer
Early Z test, Re-Z, Z Range optimization, and Fast Z Clear
Lossless Z & stencil compression (up to 128:1)
Lossless color compression (up to 8:1)
8 render targets (MRTs) with anti-aliasing support
Physics processing support
Full support for Micr.......
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