The Intel® Pentium® III processor on 0.13 micron process for the PGA370 socket is the next member of the P6 family in the Intel IA-32 processor line. The Intel® Pentium® III processor on 0.13 micron process will continue in the package technology called flip-chip pin grid array but will contain a Integrated Heat Spreader (IHS]. The flip-chip with IHS package will be labeled as FC-PGA2 and will utilize the same 370-pin zero insertion force socket (PGA370). Thermal solutions contact the IHS directly for the FC-PGA2 package and not to the bare-die as with the FC-PGA attachment.