The Intel® Pentium® M processor, in conjunction with the Intel® 855 chipset family and the Intel® PRO/Wireless 2200BG network connection, is a key component of Intel® Centrino™ mobile technology. Based on 90 nm process technology, the Intel® Pentium® M processor is available at speeds up to 2 GHz. It includes architecture enhancements such as Enhanced Register Access and Manager Enhanced Data Fetcher, with 2MB Power Optimized L2 Cache. The power-optimized 400-MHz processor system bus, Micro-Ops Fusion and Dedicated Stack Manager allow faster execution of instructions at lower power.
# Breakthrough Mobile Performance
* 90nm and strained silicon process technologies
Enable higher performance and allows more frequency head room
* 2 MB power-optimized L2 cache, enhanced register access manager, enhanced data pre-fetcher
Higher performance due to reduced off-chip memory accesses, more efficient register management, increased availability of valid data in L2 cache
* Power-optimized 400 MHz processor system bus, micro-ops fusion and dedicated stack manager
Allow faster execution of instructions at lower power
* Advanced instruction prediction
Enables fewer re-dos for increased performance
* Second-generation Streaming SIMD Extensions (Streaming SIMD Extensions 2)
Improves performance and allows SW compatibility with previous Intel® microprocessor generation
# Enables Extended Battery Life
* Support for Enhanced Intel SpeedStep® technology with multiple voltage and frequency operating points
Allows for a better match of performance to application demand
* Power-optimized logic design, enabling low voltage capabilities
Power-efficient transistor technology optimizes power consumption/dissipation for lower CPU average power
* Intelligent power distribution
Focuses system power where CPU needs it and shuts down anything not being used
# Thinner, Lighter Design
* Support for Intel® Mobile Voltage Positioning (Intel® MVP IV)
Dynamically lowers voltage based on processor activity to lower thermal design power, enabling smaller notebooks
* Micro FCPGA and FCBGA packaging technology
Optimized for a range of thinner, lighter designs, including <1" thick, that deliver outstanding performance†